Global (EN)ResourcesContact
Industries

Designed for AI-scale infrastructure

Aegival supports liquid cooling integration in data-intensive environments where compute density, reliability, maintainability and production scalability matter.

AI infrastructure data center cooling

Application Segments

Each application has different limits around flow, serviceability, materials, packaging and supply timing. Aegival supports engineering teams in aligning these factors before production supply.

AI Data Centers

AI Data Centers

Cooling infrastructure for accelerated compute clusters, high-density racks and liquid-cooled AI servers.

Explore →
HPC Systems

HPC Systems

Fluid routing, cold-plate-side connections and rack-level assemblies for high-performance computing platforms.

Explore →
Power Electronics

Power Electronics

Cold plate integration and liquid loop assemblies for power modules, converters and high-heat-density components.

Explore →
Manufacturing Programs

Manufacturing Programs

Engineering sample confirmation, pilot batches and scalable assembly supply for hardware programs.

Explore →
Industry Requirements

Cooling integration changes by application environment

AI infrastructure cooling is not only a connector or cold plate decision. It depends on system layout, service access, coolant compatibility, flow distribution, pressure drop and production support.

High-density compute

Support for compact liquid cooling assemblies where airflow alone is no longer sufficient.

Rack-level serviceability

Routing and interconnect choices that reduce maintenance complexity and improve field replacement handling.

Scalable supply

Selected manufacturing coordination from engineering confirmation to pilot and production batches.

Data center thermal infrastructure

Engineering Focus by Industry

AI

AI Servers

High heat flux, compact packaging and cold-plate-side routing requirements.

HPC

HPC Platforms

Stable thermal performance, parallel flow paths and reliable distribution assemblies.

DC

Data Centers

Rack-level maintainability, quick service interfaces and infrastructure-side integration.

PE

Power Electronics

Cooling for converters, power modules and thermal control in compact spaces.

MFG

Hardware Programs

Sample confirmation, batch traceability and manufacturing partner coordination.

Engineering integration discussion

Discuss an application-specific cooling requirement

Share your application environment, interface constraints, coolant conditions and production expectations. Aegival can help review possible liquid cooling assembly paths for engineering confirmation.

Contact engineering